1. 2. 3. material content data sheet sales product name tle4963-2m issued 24. august 2015 ma# ma001106126 package pg-sot23-3-15 weight* 9.78 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.220 2.25 2.25 22463 22463 leadframe inorganic material silicon 7440-21-3 0.001 0.01 74 non noble metal titanium 7440-32-6 0.004 0.04 369 non noble metal chromium 7440-47-3 0.011 0.11 1106 non noble metal copper 7440-50-8 3.590 36.72 36.88 367219 368768 wire noble metal gold 7440-57-5 0.023 0.24 0.24 2355 2355 encapsulation organic material carbon black 1333-86-4 0.055 0.56 5619 plastics epoxy resin - 1.181 12.08 120813 inorganic material silicondioxide 60676-86-0 4.257 43.55 56.19 435491 561923 leadfinish non noble metal tin 7440-31-5 0.150 1.53 1.53 15308 15308 plating noble metal silver 7440-22-4 0.149 1.52 1.52 15200 15200 glue plastics epoxy resin - 0.024 0.24 2447 noble metal silver 7440-22-4 0.113 1.15 1.39 11536 13983 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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